Mon, 09/06/2021 – 16:36
As chipmakers move to advanced technology nodes, they are challenged to resolve ever-finer features. One of the major roadblocks involves the material used to transfer chip design to the wafer; that material is rapidly reaching its limit to accurately transfer designs. To keep next-generation device scaling on track, a breakthrough technology called Dry Resist is introduced. To better understand this solution, let’s first take a closer look at the patterning process and current photoresists, then discuss the potential advantages of the new solution.